GB8400 Ethernet Switching Chip (Under Development)
date：2026-03-12 / popularity： / source：
- The GB8400 series are independently developed data center Ethernet switching chips with switching bandwidth of 12.8Tbps to 28.8Tbps.Designed for traditional cloud data centers, enterprise core networks and campus networks, they support up to 400G high-speed interfaces and can be flexibly configured for rate combinations including 200G/100G/50G/25G/10G.Adopting an advanced process, the chips integrate a high-performance switching fabric and proprietary protocol stack, featuring low latency, high reliability and large buffer capacity.They deliver high-performance, scalable Layer 2/3 switching solutions for data centers and enterprise networks, and are core products for China’s high-end data center switching chip portfolio.
Features
- Core Switching & Interface Features
- Total switching capacity: configurable 12.8Tbps–28.8Tbps, supporting full line-rate non-blocking forwarding
- Supports up to 400G interfaces, compatible with multi-rate interfaces including 200G/100G/50G/25G/10G, and compliant with high-speed Ethernet standards such as IEEE 802.3bs/802.3cd
- Supports line-rate forwarding of jumbo frames up to 16KB to meet high-bandwidth service requirements such as big data and cloud computing
- Supports overlay networking technologies including SRv6, EVPN and VXLAN, adapting to cloud data center and enterprise cloud-based network architectures
- Supports multi-path technologies including ECMP/UCMP load balancing, TRILL and SPB to improve network resilience and resource utilization
- Layer 2 / Layer 3 Protocol Features
- Supports MAC address learning, filtering and aging, with up to 128K MAC address table entries
- Supports IEEE 802.1Q VLAN and QinQ (Stacking VLAN), with up to 16K VLAN/SVLAN entries
- Supports IPv4/IPv6 dual stack and dynamic routing protocols including BGP, OSPF and ISIS to satisfy large-scale Layer 3 networking requirements
- Supports STP/RSTP/MSTP and 802.3ad link aggregation to ensure network redundancy and high availability
- Supports hardware-based IGMP Snooping/MLD Snooping for efficient multicast service processing
- Supports O&M protocols including LLDP, OAM and Loop Detection to simplify network management and fault localization
- Security & QoS Features
- Supports 2K+ ACL rules to implement fine-grained access control based on 5-tuple and Layer 2 information
- Supports 802.1X authentication, port isolation and automatic protection against DDoS/flood attacks to enhance network security
- Supports 8-level QoS queues for DSCP/802.1p-based traffic scheduling and congestion control
- Supports port mirroring, traffic sampling and storm suppression to meet network monitoring and compliance requirements
- Supports SRv6 Segment Routing to deliver end-to-end SLA assurance and traffic engineering
Management and Scalability
- Integrates a management CPU and supports management interfaces including I2C, SMI, SPI and UART, and can connect to an external CPU for centralized management.
- Supports Boot ROM + Flash booting, online firmware upgrade and configuration persistence.
- Supports Telemetry for real-time reporting of port status, buffer utilization, traffic statistics and other metrics.
- Compatible with standard MIB counters (RFC 1213, RFC 3635, etc.) and interoperable with mainstream network management platforms.
Typical Applications
- Traditional cloud data center Spine-Leaf architecture: Acts as Leaf/Spine nodes to build a 400G high-speed interconnect network.
- Enterprise core network / campus network core switching: Supports high-density, highly reliable networking between enterprise headquarters and branches.
- Data center gateway and border switching: Enables high-speed forwarding and security control between internal and external data center networks.
- Hyper-converged enterprise data centers: Supports VM/container networking and adapts to enterprise cloud technologies such as VXLAN and EVPN.
- High-density port expansion and on-board interconnection: Meets requirements for equipment expansion and higher port density in data centers.
Package and Power Consumption
- Adopts advanced FCBGA packaging, suitable for high-density data center and enterprise-level board designs.
- Supports multi-voltage domain power supply and dynamic power management to meet energy-saving requirements of data centers and enterprise equipment rooms.
- Operating temperature: 0–85°C (industrial grade optional: −40–85°C), suitable for various equipment room environments.